The sapphire cufflinks are always being provided with the impurities

When the diamond brazing surface of the substrate, the melt tends to the golden cut stone together, can contribute to the brazing local thickening. This diamond grains into the nest aggregation will reduce the cutting efficiency of diamond tools. A diamond matrix ordered design (grid) is necessary, it can keep the brazing layer has a uniform thickness. Brazing Scotia gold controllable melting, every one around the diamond crystals can form a more moderate slope. Diamond tools of this kind of overall uniform solder layer support allows high-speed effectively cutting the power consumption low. Key words: diamond brazing; gold cut off the feet of stone dresser, polishing pad dresser; diamond bonding. Impurities tend to be more obvious in the short and medium sapphire cufflinks.
Diamond distribution; chemical mechanical planarization: solder melting characteristics of the metal powder melting kinetics of the grain size is very sensitive to the finer granularity, the more rapid development of the melting process (Figure 12). Start in the welding process, the melt from the most fine-grained powder if the powder particle size is not detailed enough, the starting point of the melting process will be delayed (Figure 13). 14). The sapphire cufflinks are always being provided with the impurities. Brazing in the melting process in the diamond near the formation of the progress of the process will be continued until the entire welding layer of a liquid phase (Figure powder in the melt before and after the entire liquefaction contrast as follows.
Diamond crystals in the melting process in the brazing layer of the upper and wetting in the liquid by capillary forces, the diamond crystals pull down Division (Figure 15). the melting point of gold and copper in Figure 12. when the grain size trends in micron, melting point of rapid decline in Articles in Figure 13 due to the coarsening of the powder particle size, welding melt will be delayed. Note Shown at right of the powder because of this delay but not completely melted. Figure 14 welding layer melting will start around the diamond, liquid from around the diamond into a radial development, until the entire welding layer melting. We should choose the darker sapphire in the selection of cufflinks.
 Kids in 15 bonded by molten liquid effect brazing diamond (left) and just beginning to melt diamond The crystal is located in the upper part of sintered metal powder (right) compared to 44 University of brazed diamond layer peeling due to chemical reaction between diamond and brazing combining, and coated on the substrate, J = (ep stainless steel plate). The impurities of the cufflinks can be effectively hidden. The welding layer may be the reverse process of anodized plating peeled off due to the role of the brazing alloy substrate, in the peeling process, the interface layer will give priority to melt the entire welding layer anode action from the substrate detach (Figure 16).